LAPSE:2023.36476
Published Article
LAPSE:2023.36476
A Novel Dynamic Process Monitoring Algorithm: Dynamic Orthonormal Subspace Analysis
Weichen Hao, Shan Lu, Zhijiang Lou, Yonghui Wang, Xin Jin, Syamsunur Deprizon
August 2, 2023
Orthonormal subspace analysis (OSA) is proposed for handling the subspace decomposition issue and the principal component selection issue in traditional key performance indicator (KPI)-related process monitoring methods such as partial least squares (PLS) and canonical correlation analysis (CCA). However, it is not appropriate to apply the static OSA algorithm to a dynamic process since OSA pays no attention to the auto-correlation relationships in variables. Therefore, a novel dynamic OSA (DOSA) algorithm is proposed to capture the auto-correlative behavior of process variables on the basis of monitoring KPIs accurately. This study also discusses whether it is necessary to expand the dimension of both the process variables matrix and the KPI matrix in DOSA. The test results in a mathematical model and the Tennessee Eastman (TE) process show that DOSA can address the dynamic issue and retain the advantages of OSA.
Keywords
dynamic process, key performance indicators, orthonormal subspace analysis, process monitoring
Suggested Citation
Hao W, Lu S, Lou Z, Wang Y, Jin X, Deprizon S. A Novel Dynamic Process Monitoring Algorithm: Dynamic Orthonormal Subspace Analysis. (2023). LAPSE:2023.36476
Author Affiliations
Hao W: School of Information and Control Engineering, Liaoning Petrochemical University, Fushun 113005, China
Lu S: Institute of Intelligence Science and Engineering, Shenzhen Polytechnic, Shenzhen 518055, China [ORCID]
Lou Z: Institute of Intelligence Science and Engineering, Shenzhen Polytechnic, Shenzhen 518055, China
Wang Y: Faculty of Engineering, Technology & Built Environment, UCSI University, Kuala Lumpur 56000, Malaysia
Jin X: School of Information and Control Engineering, Liaoning Petrochemical University, Fushun 113005, China [ORCID]
Deprizon S: Faculty of Engineering, Technology & Built Environment, UCSI University, Kuala Lumpur 56000, Malaysia; Postgraduate Department, Universitas Bina Darma, Palembang 30111, Indonesia [ORCID]
Journal Name
Processes
Volume
11
Issue
7
First Page
1935
Year
2023
Publication Date
2023-06-27
Published Version
ISSN
2227-9717
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Original Submission
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PII: pr11071935, Publication Type: Journal Article
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LAPSE:2023.36476
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doi:10.3390/pr11071935
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Aug 2, 2023
 
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Original Submitter
Calvin Tsay
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