LAPSE:2023.34167
Published Article
LAPSE:2023.34167
Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”
April 25, 2023
With the further innovation of chip technology, semiconductor integrated circuits have made irreplaceable contributions to the development of microelectronic systems [...]
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Suggested Citation
Zhu Z, Zhang S, Ma S, Liu Z. Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”. (2023). LAPSE:2023.34167
Author Affiliations
Zhu Z: College of Electronic and Information Engineering, Southwest University, Chongqing 400715, China
Zhang S: College of Electronic and Information Engineering, Southwest University, Chongqing 400715, China
Ma S: Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China
Liu Z: School of Microelectronic, Fudan University, 220 Handan Rd., Shanghai 200433, China
Zhang S: College of Electronic and Information Engineering, Southwest University, Chongqing 400715, China
Ma S: Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China
Liu Z: School of Microelectronic, Fudan University, 220 Handan Rd., Shanghai 200433, China
Journal Name
Processes
Volume
11
Issue
3
First Page
816
Year
2023
Publication Date
2023-03-09
Published Version
ISSN
2227-9717
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Original Submission
Other Meta
PII: pr11030816, Publication Type: Editorial
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Published Article
LAPSE:2023.34167
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doi:10.3390/pr11030816
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[v1] (Original Submission)
Apr 25, 2023
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Apr 25, 2023
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