This paper examines a microconstruction consisting of nickel (Ni)/chromium (Cr) alloy thin-film. The total length of the microconstruction was 28 mm, the width was 0.2 mm, and the height was designed to be 1 μm. A thin-film of Ni/Cr alloy was co-sputtered on a silicon dioxide wafer patterned with photoresist via a RF magnetron sputtering system. The RF power ratios applied to the 4 inch target of Ni and Cr were 300 W:100 W (3:1), 300 W:150 W (2:1), and 150 W:150 W (1:1). The electrical resistance of the manufactured microconstruction was calculated and measured through Hall measurements. The temperature generated by applying 1−10 V to the microconstruction electrode was observed by using an infrared camera, and was summarized using a linear equation according to the power applied to each sample.