LAPSE:2023.31843
Published Article
LAPSE:2023.31843
Accurate Circuit-Level Modelling of IGBTs with Thermal Phenomena Taken into Account
April 19, 2023
This paper proposes a new compact electrothermal model of the Insulated Gate Bipolar Transistors (IGBT) dedicated for SPICE (Simulation Program with Integrated Circuit Emphasis). This model makes it possible to compute the non-isothermal DC characteristics of the considered transistor and the waveforms of terminal voltages and currents of the investigated device and its internal temperature at transients. This model takes into account the nonlinearity of thermal phenomena in this device. The form of the formulated model is described and the problem of estimating its parameter values is discussed. The correctness of the proposed model was verified experimentally both at DC operation and at transients. The obtained results are compared to the results of computations performed with the use of the classical literature model. A very good agreement between the results of measurements and computations performed with the new model is obtained at different cooling conditions and in a wide range of changes of parameters characterising the electrical excitation of the tested device.
Keywords
compact electrothermal model, IGBT, Modelling, self-heating, SPICE, thermal phenomena
Suggested Citation
Górecki P, Górecki K, Zarębski J. Accurate Circuit-Level Modelling of IGBTs with Thermal Phenomena Taken into Account. (2023). LAPSE:2023.31843
Author Affiliations
Górecki P: Department of Marine Electronics, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland [ORCID]
Górecki K: Department of Marine Electronics, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland [ORCID]
Zarębski J: Department of Marine Electronics, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland
Journal Name
Energies
Volume
14
Issue
9
First Page
2372
Year
2021
Publication Date
2021-04-22
Published Version
ISSN
1996-1073
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Original Submission
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PII: en14092372, Publication Type: Journal Article
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LAPSE:2023.31843
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doi:10.3390/en14092372
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Apr 19, 2023
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Apr 19, 2023
 
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