LAPSE:2023.27347
Published Article
LAPSE:2023.27347
Cooling Panel with Integrated PCM Layer: A Verified Simulation Study
Renars Millers, Aleksandrs Korjakins, Arturs Lešinskis, Anatolijs Borodinecs
April 4, 2023
The focus of this research paper is to develop a verified simulation model for a cooling panel with integrated phase-change materials (PCMs)—a stainless steel panel filled with PCM and integrated hydronic piping circuit. This solution is targeted for passive cooling of residential buildings in Baltic Sea region that experience overheating for most of the year due to highly insulated building envelopes and extensive glazing—a phenomena for nearly zero energy buildings (NZEBs). This approach aims to maintain comfortable indoor temperature all year round by passive means—free-cooling, adiabatic (evaporative) cooling or limited mechanical cooling. The simulations are performed with IDA ICE 4.8 and the measurements for simulation model verification are collected from a test chamber. The results show that reasonable agreement can be reached for simulated and experimentally measured data.
Keywords
cooling panel, Energy Storage, overheating, passive cooling, PCM, TABS
Suggested Citation
Millers R, Korjakins A, Lešinskis A, Borodinecs A. Cooling Panel with Integrated PCM Layer: A Verified Simulation Study. (2023). LAPSE:2023.27347
Author Affiliations
Millers R: Institute of Heat, Gas and Water Technology, Riga Technical University, Kalku street 1, Riga LV-1658, Latvia
Korjakins A: Institute of Materials and Structures, Riga Technical University, Kalku Street 1, Riga LV-1658, Latvia [ORCID]
Lešinskis A: Institute of Heat, Gas and Water Technology, Riga Technical University, Kalku street 1, Riga LV-1658, Latvia
Borodinecs A: Institute of Heat, Gas and Water Technology, Riga Technical University, Kalku street 1, Riga LV-1658, Latvia [ORCID]
Journal Name
Energies
Volume
13
Issue
21
Article Number
E5715
Year
2020
Publication Date
2020-11-02
Published Version
ISSN
1996-1073
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PII: en13215715, Publication Type: Journal Article
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LAPSE:2023.27347
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doi:10.3390/en13215715
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Apr 4, 2023
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