LAPSE:2023.10982
Published Article

LAPSE:2023.10982
Parametric Study of Panel PCM−Air Heat Exchanger Designs
February 27, 2023
Abstract
Heat exchangers, devices for the transfer of heat between two or more working fluids, are extensively used in cooling applications and heating applications. Heat exchangers in buildings are typically components of space-conditioning systems, as well as of water-heating applications. Heat exchangers are also sometimes used in applications that require storage and release of energy at specific times. Phase change materials (PCMs) enhance these heat-exchange processes, given their ability to melt and solidify at a fixed range of temperatures, absorbing or releasing significant amounts of latent heat. Five different configurations of PCM−air heat exchangers for thermal control in buildings are analyzed in this work. The heat exchangers were fitted with PCM encapsulated in plastic and composite pouches of various shapes, and packaged in stackable panel layers. Three-dimensional computational fluid dynamics (CFD) modeling of coupled incompressible fluid and conjugate heat transfer were performed on the designs. The phase change process was numerically modelled using the apparent heat capacity method. Steady-state CFD simulations provided quantification of pressure drop as a function of air flow velocity. Transient simulation results describe the thermal evolution of PCM in the pouches, helping to determine the best performing configuration with respect to total thermal charging time.
Heat exchangers, devices for the transfer of heat between two or more working fluids, are extensively used in cooling applications and heating applications. Heat exchangers in buildings are typically components of space-conditioning systems, as well as of water-heating applications. Heat exchangers are also sometimes used in applications that require storage and release of energy at specific times. Phase change materials (PCMs) enhance these heat-exchange processes, given their ability to melt and solidify at a fixed range of temperatures, absorbing or releasing significant amounts of latent heat. Five different configurations of PCM−air heat exchangers for thermal control in buildings are analyzed in this work. The heat exchangers were fitted with PCM encapsulated in plastic and composite pouches of various shapes, and packaged in stackable panel layers. Three-dimensional computational fluid dynamics (CFD) modeling of coupled incompressible fluid and conjugate heat transfer were performed on the designs. The phase change process was numerically modelled using the apparent heat capacity method. Steady-state CFD simulations provided quantification of pressure drop as a function of air flow velocity. Transient simulation results describe the thermal evolution of PCM in the pouches, helping to determine the best performing configuration with respect to total thermal charging time.
Record ID
Keywords
Computational Fluid Dynamics, design optimization, heat exchanger, PCM
Subject
Suggested Citation
Kamidollayev T, Trelles JP, Thakkar J, Kosny J. Parametric Study of Panel PCM−Air Heat Exchanger Designs. (2023). LAPSE:2023.10982
Author Affiliations
Kamidollayev T: Department of Mechanical Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA
Trelles JP: Department of Mechanical Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA [ORCID]
Thakkar J: Department of Plastics Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA
Kosny J: Department of Mechanical Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA
Trelles JP: Department of Mechanical Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA [ORCID]
Thakkar J: Department of Plastics Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA
Kosny J: Department of Mechanical Engineering, University of Massachusetts Lowell, Lowell, MA 01854, USA
Journal Name
Energies
Volume
15
Issue
15
First Page
5552
Year
2022
Publication Date
2022-07-30
ISSN
1996-1073
Version Comments
Original Submission
Other Meta
PII: en15155552, Publication Type: Journal Article
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LAPSE:2023.10982
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https://doi.org/10.3390/en15155552
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Feb 27, 2023
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