Abstract
This elaboration presents the concept of the design, parameters, experimental investigation, and thermal numerical model solved using the finite element method of a high-power-density DC−DC converter. The analyzed unit can be utilized as a stand-alone converter or as a module for a scalable high-voltage gain system. The converter has a decreased bill of materials since it does not use typical chokes and heatsinks. It is based on switched capacitor circuits supported by a resonant choke which protects against inrush currents. A printed circuit board is utilized not only for the resonant inductance design but also for cooling transistor and diode devices. The paper demonstrates the design concept and the achieved parameters. Experimental results show heat distribution on the printed circuit board and components in a steady state and dynamical states as well. The converter parameters and their efficiency are measured as well. The convergence of experimental results and heating simulations is demonstrated. The numerical model is used for the investigation of design cases. The printed circuit board size, thermal via pattern, and heating process during the overload of the converter are investigated.