Abstract
High-power electronic devices with multiple heat sources often require temperature uniformity and to operate within their functional temperature range for optimal performance. Micro-channel cooling could satisfy the heat dissipation requirements, but it may cause temperature non-uniformity. In this paper, simulations are performed for different geometric parameters of the channel and the position of the heat source. The results show that a flattened channel can effectively reduce the heat source temperature, broadening the straight channel can reduce the flow resistance and enhance heat transfer, while widening the channel at the bend may lead to local dryness. Meanwhile, a thermal model is established to analyze the influence of the position of the heat source. The results also show that with the increase in the curved channel radius, the phenomenon of vapor−liquid separation becomes more obvious, the pressure drop decreases, but the heat transfer effect worsens.