Abstract
In order to meet increasing power-dissipation requirements of the electronics industry, compact, low-cost, and lightweight heat exchangers (HXs) are desired. With proper design, materials, and manufacture, polymer composite heat exchangers could meet these requirements. This paper presents a novel crossflow air-to-water, low-cost, and lightweight metal-polymer composite HX. This HX, which is entirely additively manufactured, utilizes a novel cross-media approach that provides direct heat exchange between air and liquid sides by using connecting fins. A robust numerical model was developed, which includes the dimensional effects of additive manufacturing. The study consists of a simplified 3D CFD model based on ellipsoidal-shaped staggered tube banks for the laminar range. It then uses an analytical approach to compute entire HX performance. The model is validated experimentally within 8% for thermal performance, 12% for air-side impedance, and 18% for water-side impedance. Finally, HX is compared with a conventional CPU radiator and performs within 10% of the conventional unit for reasonable flow rates and pressure-drop ranges. Moreover, HX also provides added design and cost advantages over the conventional unit, which makes the HX a potential candidate for electronic cooling applications.