LAPSE:2023.1500
Published Article
LAPSE:2023.1500
Effects of Coating Parameters of Hot Filament Chemical Vapour Deposition on Tool Wear in Micro-Drilling of High-Frequency Printed Circuit Board
Fung Ming Kwok, Zhanwen Sun, Wai Sze Yip, Kwong Yu David Kwok, Suet To
February 21, 2023
Abstract
High-frequency and high-speed printed circuit boards (PCBs) are made of ceramic particles and anisotropic fibres, which are difficult to machine. In most cases, severe tool wear occurs when drilling high-frequency PCBs. To protect the substrate of the drills, diamond films are typically fabricated on the drills using hot filament chemical vapour deposition (HFCVD). This study investigates the coating characteristics of drills with respect to different HFCVD processing parameters and the coating characteristics following wear from machining high-frequency PCBs. The results show that the methane concentration, processing time and temperature all have a significant effect on the grain size and coating thickness of the diamond film. The grain size of the film obviously decreases as does the methane concentration, while the coating thickness increases. By drilling high-frequency PCBs with drills with nanocrystalline and microcrystalline grain sizes, it is discovered that drills with nanocrystalline films have a longer tool life than drills with microcrystalline films. The maximum length of the flank wear of the nanocrystalline diamond-coated drill is nearly 90% less than microcrystalline diamond-coated tools. Moreover, drills with thinner films wear at a faster rate than drills with thicker films. The findings highlight the effects of HFCVD parameters for coated drills that process high-frequency PCBs, thereby contributing to the production of high quality PCBs for industry and academia.
Keywords
coating technology, drilling, high-frequency PCB, hot filament chemical vapor deposition, tool wear
Suggested Citation
Kwok FM, Sun Z, Yip WS, Kwok KYD, To S. Effects of Coating Parameters of Hot Filament Chemical Vapour Deposition on Tool Wear in Micro-Drilling of High-Frequency Printed Circuit Board. (2023). LAPSE:2023.1500
Author Affiliations
Kwok FM: State Key Laboratory in Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China
Sun Z: State Key Laboratory in Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China; State Key Laboratory of Precision Electronic Manufacturing Technology and Equi
Yip WS: State Key Laboratory in Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China
Kwok KYD: Techmart (Shenzhen) Limited, 2F, Block 2, No. 2 Chongqing Road, Qiaotou Community, Fuyong Subdistrict, Bao’an District, Shenzhen 518104, China
To S: State Key Laboratory in Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China [ORCID]
Journal Name
Processes
Volume
10
Issue
8
First Page
1466
Year
2022
Publication Date
2022-07-27
ISSN
2227-9717
Version Comments
Original Submission
Other Meta
PII: pr10081466, Publication Type: Journal Article
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LAPSE:2023.1500
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https://doi.org/10.3390/pr10081466
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Feb 21, 2023
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