Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer

Qi Zheng; Haiyun Xue; Fengman Liu; Liqiang Cao; Qidong Wang; Huimin He; Fengwei Dai; Peng Sun

LAPSE

Living Archive for Process Systems Engineering

LAPSE:2023.0874

Published Article

LAPSE:2023.0874

Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer

Qi Zheng, Haiyun Xue, Fengman Liu, Liqiang Cao, Qidong Wang, Huimin He, Fengwei Dai, Peng Sun

February 21, 2023

The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and evaluated. The problem of the co-fabrication of the TSV and edge coupler was solved, and perfect electrical and optical characteristics were also achieved. Finally, the fabrication of the substrate and the assembly of the 3D optical module were completed. This paper lays a solid foundation for the further research and large-scale application of 3D optical modules in the future.

Record ID

LAPSE:2023.0874

Keywords

3D integration, active photonic interposer, optical interconnection, TSV

Subject

Process Design

Suggested Citation

Zheng Q, Xue H, Liu F, Cao L, Wang Q, He H, Dai F, Sun P. Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer. (2023). LAPSE:2023.0874

Author Affiliations

Zheng Q: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China [ORCID]
Xue H: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China [ORCID]
Liu F: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
Cao L: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
Wang Q: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China [ORCID]
He H: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
Dai F: System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
Sun P: National Center for Advanced Packaging, Wuxi 214111, China

Journal Name

Processes

Volume

10

Issue

11

First Page

2342

Year

2022

Publication Date

2022-11-10