LAPSE:2023.11401
Published Article

LAPSE:2023.11401
A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts
February 27, 2023
Abstract
The application of adhesively bonded joints in aerospace structural parts has increased significantly in recent years and the general advantages of their use are well-documented. One of the disadvantages of adhesive bonding is the relevant permanence, when compared to traditional mechanical fastening. End-of-life processes generally require the separation of the adherents for repair or recycling, and usually to achieve this, they combine large mechanical forces with a high temperature, thus damaging the adherents, while consuming large amounts of energy. In this work, a novel disassembly technique based on laser-induced shock waves is proposed for the disassembly of multi-material adhesively bonded structures. The laser shock technique can generate high tensile stresses that are able to break a joint, while being localized enough to avoid damaging the involved adherents. The process is applied to specimens made from a 3D-woven CFRP core bonded to a thin Ti layer, which is a common assembly used in state-of-the-art aircraft fan blades. The experimental process has been progressively developed. First, a single-sided shot is applied, while the particle velocity is measured at the back face of the material. This method proves ineffective for damage creation and led to a symmetric laser configuration, so that the tensile stress can be controlled and focused on the bond line. The symmetric approach is proved capable of generating a debonding between the Ti and the CFRP and propagating it by moving the laser spot. Qualitative assessment of the damage that is created during the symmetric experimental process indicates that the laser shock technique can be used as a material separation method.
The application of adhesively bonded joints in aerospace structural parts has increased significantly in recent years and the general advantages of their use are well-documented. One of the disadvantages of adhesive bonding is the relevant permanence, when compared to traditional mechanical fastening. End-of-life processes generally require the separation of the adherents for repair or recycling, and usually to achieve this, they combine large mechanical forces with a high temperature, thus damaging the adherents, while consuming large amounts of energy. In this work, a novel disassembly technique based on laser-induced shock waves is proposed for the disassembly of multi-material adhesively bonded structures. The laser shock technique can generate high tensile stresses that are able to break a joint, while being localized enough to avoid damaging the involved adherents. The process is applied to specimens made from a 3D-woven CFRP core bonded to a thin Ti layer, which is a common assembly used in state-of-the-art aircraft fan blades. The experimental process has been progressively developed. First, a single-sided shot is applied, while the particle velocity is measured at the back face of the material. This method proves ineffective for damage creation and led to a symmetric laser configuration, so that the tensile stress can be controlled and focused on the bond line. The symmetric approach is proved capable of generating a debonding between the Ti and the CFRP and propagating it by moving the laser spot. Qualitative assessment of the damage that is created during the symmetric experimental process indicates that the laser shock technique can be used as a material separation method.
Record ID
Keywords
3D-woven CFRP, bonded structures, disassembly and recycle, laser adhesion test, laser shock
Subject
Suggested Citation
Kormpos P, Unaldi S, Berthe L, Tserpes K. A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts. (2023). LAPSE:2023.11401
Author Affiliations
Kormpos P: Laboratory of Technology & Strength of Materials (LTSM), Department of Mechanical Engineering & Aeronautics, University of Patras, 26504 Patras, Greece [ORCID]
Unaldi S: PIMM, UMR8006 ENSAM, CNRS, CNAM, 151 bd de l’Hôpital, 75013 Paris, France
Berthe L: PIMM, UMR8006 ENSAM, CNRS, CNAM, 151 bd de l’Hôpital, 75013 Paris, France
Tserpes K: Laboratory of Technology & Strength of Materials (LTSM), Department of Mechanical Engineering & Aeronautics, University of Patras, 26504 Patras, Greece [ORCID]
Unaldi S: PIMM, UMR8006 ENSAM, CNRS, CNAM, 151 bd de l’Hôpital, 75013 Paris, France
Berthe L: PIMM, UMR8006 ENSAM, CNRS, CNAM, 151 bd de l’Hôpital, 75013 Paris, France
Tserpes K: Laboratory of Technology & Strength of Materials (LTSM), Department of Mechanical Engineering & Aeronautics, University of Patras, 26504 Patras, Greece [ORCID]
Journal Name
Processes
Volume
11
Issue
2
First Page
506
Year
2023
Publication Date
2023-02-07
ISSN
2227-9717
Version Comments
Original Submission
Other Meta
PII: pr11020506, Publication Type: Journal Article
Record Map
Published Article

LAPSE:2023.11401
This Record
External Link

https://doi.org/10.3390/pr11020506
Publisher Version
Download
Meta
Record Statistics
Record Views
263
Version History
[v1] (Original Submission)
Feb 27, 2023
Verified by curator on
Feb 27, 2023
This Version Number
v1
Citations
Most Recent
This Version
URL Here
https://psecommunity.org/LAPSE:2023.11401
Record Owner
Auto Uploader for LAPSE
Links to Related Works
[1.08 s]
