Preparation of Thermally Conductive Silicone Rubber-Based Ultra-Thin Sheets with Low Thermal Resistance and High Mechanical Properties

Mengqi Liu; Shengfu Tong; Xinhua Guo; Jing Ye; Jianping Liu; Chenlu Bao

LAPSE

Living Archive for Process Systems Engineering

LAPSE:2023.35258

Published Article

LAPSE:2023.35258

Preparation of Thermally Conductive Silicone Rubber-Based Ultra-Thin Sheets with Low Thermal Resistance and High Mechanical Properties

Mengqi Liu, Shengfu Tong, Xinhua Guo, Jing Ye, Jianping Liu, Chenlu Bao

April 28, 2023

Thermally conductive silicone rubber (TCSR)-based thin sheets with low thermal resistance and high electrical insulation properties have been widely used in thermal management applications in the electronic and energy storage fields. The low thermal resistance is mainly attributed to the sheets’ small thickness. In order to further decrease the sheets’ thermal resistance, it is necessary to decrease their thickness. However, the sheets mostly have a thickness of at least 0.20 mm, and it is still a challenge to decrease the thickness to less than 0.10 mm mainly due to the difficulty of smooth calendering through a narrow roll-to-roll gap on calenders. Here, a low-viscosity calendering method has been developed to prepare TCSR-based ultra-thin sheets. The sheets present unprecedentedly small thickness (~0.08 mm), low thermal resistance (0.87 cm2K/W), high tensile strength (~8 MPa), high flexibility, high electrical resistance (>1014 Ω·cm), and high thermal dissipation (>30 °C decrease in LED working temperature). Comparison studies between this new method and the conventional preparation method have been carried out to understand the mechanism of the improvements.

Record ID

LAPSE:2023.35258

Keywords

calendering process, thermal dissipation, thermal resistance, thermally conductive silicone rubber, thin sheets

Subject

Materials

Suggested Citation

Liu M, Tong S, Guo X, Ye J, Liu J, Bao C. Preparation of Thermally Conductive Silicone Rubber-Based Ultra-Thin Sheets with Low Thermal Resistance and High Mechanical Properties. (2023). LAPSE:2023.35258

Author Affiliations

Liu M: School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China; Tianjin HaiTe Thermal Management Technology Co., Ltd., 6 Huake Eight Road, Tianjin 300450, China; Sichuan Ximaiwan Technology Co., Ltd., 6668 Se
Tong S: Zhejiang Public Information Industry Co., Ltd., A3-3, China Telecom Zhejiang Innovation Park, 8 Xiqin Street, Hangzhou 311100, China
Guo X: School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China; Tianjin HaiTe Thermal Management Technology Co., Ltd., 6 Huake Eight Road, Tianjin 300450, China
Ye J: School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China
Liu J: School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China; Sichuan Ximaiwan Technology Co., Ltd., 6668 Section 2 Qingquan Avenue, Chengdu 610300, China
Bao C: School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China; Tianjin HaiTe Thermal Management Technology Co., Ltd., 6 Huake Eight Road, Tianjin 300450, China; Sichuan Ximaiwan Technology Co., Ltd., 6668 Se

Journal Name

Processes

Volume

11

Issue

4

First Page

1184

Year

2023

Publication Date

2023-04-12