LAPSE:2023.34726
Published Article

LAPSE:2023.34726
Influence of Thermal Phenomena on the Characteristics of Selected Electronics Networks
April 27, 2023
Abstract
This paper presents the results of investigations on the influence of thermal phenomena—self-heating in semiconductor devices and mutual thermal couplings between them—on the characteristics of selected electronics networks containing bipolar transistors (BJTs) or insulated gate bipolar transistors (IGBTs). Using the authors’ compact electrothermal models of the transistors mentioned above, the non-isothermal DC and dynamic characteristics of these devices and selected networks with these devices are calculated. Their selected characteristics are compared with the measurement results. The waveforms of currents in the considered networks are also determined taking into account thermal phenomena. Discrepancies between the obtained calculation and measurement results and the calculation results obtained without thermal phenomena are indicated. In particular, attention is paid to cooling conditions at which the networks under consideration may be damaged due to thermal phenomena.
This paper presents the results of investigations on the influence of thermal phenomena—self-heating in semiconductor devices and mutual thermal couplings between them—on the characteristics of selected electronics networks containing bipolar transistors (BJTs) or insulated gate bipolar transistors (IGBTs). Using the authors’ compact electrothermal models of the transistors mentioned above, the non-isothermal DC and dynamic characteristics of these devices and selected networks with these devices are calculated. Their selected characteristics are compared with the measurement results. The waveforms of currents in the considered networks are also determined taking into account thermal phenomena. Discrepancies between the obtained calculation and measurement results and the calculation results obtained without thermal phenomena are indicated. In particular, attention is paid to cooling conditions at which the networks under consideration may be damaged due to thermal phenomena.
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Keywords
compact electrothermal models, electronics networks, electrothermal analyses, measurements, semiconductor devices, thermal phenomena
Suggested Citation
Górecki K, Zarębski J, Górecki P. Influence of Thermal Phenomena on the Characteristics of Selected Electronics Networks. (2023). LAPSE:2023.34726
Author Affiliations
Górecki K: Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland [ORCID]
Zarębski J: Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland
Górecki P: Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland [ORCID]
Zarębski J: Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland
Górecki P: Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland [ORCID]
Journal Name
Energies
Volume
14
Issue
16
First Page
4750
Year
2021
Publication Date
2021-08-04
ISSN
1996-1073
Version Comments
Original Submission
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PII: en14164750, Publication Type: Journal Article
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LAPSE:2023.34726
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https://doi.org/10.3390/en14164750
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Apr 27, 2023
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