As one of the semiconductor back-end processes, die attach process is the process that attaches an individual non-defective die (or chip) produced from the semiconductor front-end production to the lead frame on a strip. With most other processes of semiconductor manufacturing, it is very important to improve productivity by lessening the occurrence of defective products generally represented as losses, and then find the fault causes which lower productivity of the die attach process. Thus, as the case study to analyze quantitatively the faults of the die attach process equipment, in this research, we developed analysis systems including statistical analysis functions to improve the productivity of die attach process. This research shows that the developed system can find the causes of equipment faults in die attach process equipment and help improve the productivity of the die attach process by controlling the critical parameters which cause unexpected equipment faults and losses.