LAPSE:2019.0509
Published Article
LAPSE:2019.0509
Chemical Recycling of Used Printed Circuit Board Scraps: Recovery and Utilization of Organic Products
April 15, 2019
The disposal of end-of-life printed circuit boards (PCBs) comprising cross-linked brominated epoxy resins, glass fiber, and metals has attracted considerable attention from the environmental aspect. In this study, valuable resources, especially organic material, were recovered by the effective chemical recycling of PCBs. Pulverized PCB was depolymerized by glycolysis using polyethylene glycol (PEG 200) with a molecular weight of 200 g/mol under basic conditions. The cross-linked epoxy resins were effectively decomposed into a low-molecular species by glycolysis with PEG 200, followed by the effective separation of the metals and glass fibers from organic materials. The organic material was modified into recycled polyol with an appropriate viscosity and a hydroxyl value for rigid polyurethane foams (RPUFs) by the Mannich reaction and the addition polymerization of propylene oxide. RPUFs prepared using the recycled polyol exhibited superior thermal and mechanical properties as well as thermal insulation properties compared to conventional RPUFs, indicating that the recycled polyol obtained from the used PCBs can be valuable as RPUF raw materials for heat insulation.
Keywords
chemical recycling, glycolysis, recycled polyol, rigid polyurethane foam, used printed circuit board
Subject
Suggested Citation
Shin SR, Mai VD, Lee DS. Chemical Recycling of Used Printed Circuit Board Scraps: Recovery and Utilization of Organic Products. (2019). LAPSE:2019.0509
Author Affiliations
Shin SR: Department of Semiconductor and Chemical Engineering, Chonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju 54896, Korea [ORCID]
Mai VD: Department of Semiconductor and Chemical Engineering, Chonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju 54896, Korea [ORCID]
Lee DS: Department of Semiconductor and Chemical Engineering, Chonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju 54896, Korea [ORCID]
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Journal Name
Processes
Volume
7
Issue
1
Article Number
E22
Year
2019
Publication Date
2019-01-04
Published Version
ISSN
2227-9717
Version Comments
Original Submission
Other Meta
PII: pr7010022, Publication Type: Journal Article
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LAPSE:2019.0509
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doi:10.3390/pr7010022
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Apr 15, 2019
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CC BY 4.0
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[v1] (Original Submission)
Apr 15, 2019
 
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Apr 15, 2019
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https://psecommunity.org/LAPSE:2019.0509
 
Original Submitter
Calvin Tsay
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